Effect of dummy vias on interconnect temperature variation |
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Authors: | Wang Zeng Dong Gang Yang YinTang Li JianWei |
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Institution: | Key Laboratory of the Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices,Microelectronics Institute,Xidian University,Xi'an 710071,China |
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Abstract: | The number of the dummy via can significantly affect the interconnect average temperature. This paper explores the modeling
of the interconnect average temperature in the presence of multiple dummy vias. The proposed model incorporates the multi-via
effect into the effective thermal conductivity of the interlayer dielectric (ILD) to obtain accurate results. Using different
ILDs, the multi-via effect is analyzed and discussed. Also, the extended applications of the multi-via effect are presented
in this paper to obtain the minimum interconnect average temperature increase with a given via separation or number. This
study suggests that the multi-via effect should be accounted for in integrated circuits design to optimize the performance
and design accuracy of integrated circuits. |
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Keywords: | interconnect modeling interconnect average temperature increase multi-via effect dummy via interlayer dielectric |
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