| 真空静电封接过程与分析 |
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| 引用本文： | 吴新坤,郭太良,黄振武,林建光,章秀淦,王瑞红. 真空静电封接过程与分析[J]. 福州大学学报(自然科学版), 2000, 28(2): 16-19 |
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| 作者姓名： | 吴新坤 郭太良 黄振武 林建光 章秀淦 王瑞红 |
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| 作者单位： | 福州大学电子科学与应用物理系,福建,福州,350002 |
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| 基金项目： | 福建省自然科学基金资助项目!(F96 0 2 4 ) |
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| 摘 要： | 叙述了真空静电封接技术的工艺过程 ,对封接结果做扫描电子显微镜 (SEM)断面观察 ,并对封接件断面的元素浓度的深度分布用二次离子质谱分析器 (SIMS)进行分析 ,提出了真空静电封接的类电容器结构的新模型 .
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| 关 键 词： | 真空 静电封接 工艺 分析 |
The Process and Analysis of Vacuum Electrostatic Bonding |
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| WU Xin-kun,GUO Tai-liang,HUANG Zhen-wu,LIN Jian-guang,ZHANG Xiu-gan,WANG Rui-hong. The Process and Analysis of Vacuum Electrostatic Bonding[J]. Journal of Fuzhou University(Natural Science Edition), 2000, 28(2): 16-19 |
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| Authors: | WU Xin-kun GUO Tai-liang HUANG Zhen-wu LIN Jian-guang ZHANG Xiu-gan WANG Rui-hong |
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| Affiliation: | WU Xin|kun, GUO Tai|liang, HUANG Zhen|wu, LIN Jian|guang, ZHANG Xiu|gan, WANG Rui|hong (Department of Electronic Science and Applied Physics, Fuzhou University,Fuzhou, Fujian 350002, China) |
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| Abstract: | The paper has put forward a new explanation for vacuum electrostatic bonding(VEB) model similar to capacitor's configuration by discussing the working procedure of VEB technology and observing its cross|section with scanning electron microscope (SEM) and by analyzing the element consistency distribution in depth on the workpiece cross-section with secondary ion mass spectroanalyzer (SIMS). |
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| Keywords: | vacuum electrostatic bonding techniques analysis |
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