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反应磁控溅射离子镀TiN膜的工艺参数
引用本文:杨树贵,周卓. 反应磁控溅射离子镀TiN膜的工艺参数[J]. 东北大学学报(自然科学版), 1987, 0(3)
作者姓名:杨树贵  周卓
作者单位:东北工学院应用物理教研室(杨树贵),东北工学院应用物理教研室(周卓)
摘    要:为改进反应磁控溅射离子镀氮化钛膜工艺,提高溅射速率和改善薄膜质量,本实俭测得了靶极电压与氮气流量;靶极电流与氮气流量;溅射室内气体压强与氮气流量;氮化钛膜的颜色与氮分压;靶极功率与氩气分压强的关系,以及薄膜层中氮含量、钛含量沿薄膜表面的分布。探讨了影响镀膜的主要工艺参数。

关 键 词:反应磁控溅射  离子镀  氮化钛膜

Technological Parameters of TiN--Ion Sputter Coating Using Reaction Magnetron
Yang Shugui,Zhou Zhuo. Technological Parameters of TiN--Ion Sputter Coating Using Reaction Magnetron[J]. Journal of Northeastern University(Natural Science), 1987, 0(3)
Authors:Yang Shugui  Zhou Zhuo
Affiliation:Yang Shugui;Zhou Zhuo
Abstract:To improve the technological process of TiN- ion sputter coatingusing reaction magnetron, especially to raise the sputtering rate andto improve the quality of coating, the technological parameters con-cerned are investigated experimentally. Such relationships as targetvoltage with nitrogen flowrate, target current with nitrogen flow-rate, gaseous pressure in sputtering room with nitrogen flowrate,colours of TiN coat with the partial pressure of nitrogen, and thetarget power with partial pressure of argon are all determined, aswell as the distributions of nitrogen and titanium contents in coatthroughout its surface. Main technological parameters which affectthe quality of coating are also discussed.
Keywords:reaction magnetron sputter  ion-coating  TiN film
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