| CSP工艺衔接区温度行为分析 |
| |
| 引用本文： | 韩静涛,武志平.CSP工艺衔接区温度行为分析[J].北京科技大学学报,1999,21(5):451-454. |
| |
| 作者姓名： | 韩静涛 武志平 |
| |
| 作者单位： | 北京科技大学材料科学与工程学院!北京，100083(韩静涛)，太原钢铁公司第七轧钢厂!太原市，030003(武志平，孟福才，刘千里) |
| |
| 摘 要： | 分析了CSP工艺衔接区温度的行为．首先分析坯料在入炉前的温度，指出此区域内影响坯料温度的因素、温度变化状况和冷却特点：其次研究了加热段的加热行为、加热特点、模型选择和保温要求；最后提出CSP衔接区坯料的冷却方式，并给出相应模型．
|
| 关 键 词： | CSP（CompactStripProduction） 衔接区 温度 |
Analyses on the Performance of Temperature in the Linking Region of CSP Technology |
| |
| Han Jingtao, Wu Zhiping, Meng Fucai, Liu Qianli.Analyses on the Performance of Temperature in the Linking Region of CSP Technology[J].Journal of University of Science and Technology Beijing,1999,21(5):451-454. |
| |
| Authors: | Han Jingtao Wu Zhiping Meng Fucai Liu Qianli |
| |
| Institution: | Han Jingtao, Wu Zhiping, Meng Fucai, Liu Qianli 1) |
| |
| Abstract: | The performance of temperature is analyzed in the linking region of CSP technology. Firstly, analyses are done on the temperature of the slabs before being charged. pointing out the influence factors, the changing status and the cooling features of the temperatUre of the slabs in this region. Secondly, researches of the heating of the slabs are done especially on the heating behavior, the heating characteristics, the selecting of models and the requirement on temperaure reservation in the heating stage. Finally, the cooling pattern of the slabs in the linking region of CSP is put forward, and the corresponding model presented. |
| |
| Keywords: | CSP linking region temperature |
| 本文献已被 CNKI 维普 等数据库收录！ |
