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铜固液两相共存系统的分子动力学模拟
引用本文:谢林华,朱世富,祝文军. 铜固液两相共存系统的分子动力学模拟[J]. 四川大学学报(自然科学版), 2008, 45(3): 623-627
作者姓名:谢林华  朱世富  祝文军
作者单位:1. 四川大学材料科学与工程学院,成都,610064;四川师范大学物理系,成都,610066
2. 四川大学材料科学与工程学院,成都,610064
3. 中国工程物理研究院流体物理研究所,绵阳,621900
基金项目:四川省教育厅科研基金青年项目(2006B036)
摘    要:基于Mishin势函数,用分子动力学方法模拟了金属铜的固液两相共存系统.在熔化过程中固液界面逐层推进,由collision-limited理论确定到零压下(001)表面熔点为1392.9±9.2 K,动力学系数为82.3 cm·s-1·K-1.

关 键 词:分子动力学   热力学熔点   嵌入原子势
修稿时间:2007-06-08

Molecular dynamics simulation of the solid Liquid coexistence system for copper
XIE Lin-Hua,ZHU Shi-Fu,ZHU Wen-Jun. Molecular dynamics simulation of the solid Liquid coexistence system for copper[J]. Journal of Sichuan University (Natural Science Edition), 2008, 45(3): 623-627
Authors:XIE Lin-Hua  ZHU Shi-Fu  ZHU Wen-Jun
Affiliation:College of Material Science and Engineering, Sichuan University;Department of Physics, Sichuan Normal University;College of Material Science and Engineering, Sichuan University;Institute of Fluid Physics, China Academy of Engineering Physics
Abstract:Based on the embedded atom potential proposed by Mishin, we simulated a solid/liquid coexistence system with 1500 copper atoms by molecular dynamics method. During the process of melting, the solid/liquid interface moves forward layer by layer into the solid phase. According to the collision-limited theory, we obtain the melting temperature of the (001) surface at zero pressure is 1392.9±9.2 K, and the kinetic coefficient is 82.3 cm·s-1·K-1.
Keywords:molecular dynamics   thermodynamic melting point   embedded atom potential
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