泡沫铜微孔表面池沸腾换热特性的实验研究

利用改进电镀法制备了新型的泡沫金属铜微孔表面，通过扫描电子显微镜（SEM）测定泡沫铜上微孔表面的微观结构，实验以去离子水为工质，研究了光滑表面和微孔表面的池沸腾传热特性，获得了光滑和微孔表面的池沸腾传热曲线。研究结果表明，在相同的热流密度条件下，微孔表面的汽化核心在核沸腾区密度较大，可有效降低壁面初始沸点的过热度，显著提高池沸腾的换热系数，证明该表面可用于半导体制冷系统等大型功率电子器件散热。

Experimental study on the pool boiling heat transfer characteristics of the microporous surface of copper foam

In this study, a new type of microporous surface for copper foam was prepared using an improved electroplating method. Further, the microstructure of the microporous surface of copper foam was evaluated using a scanning electron microscope (SEM). In the experiment, deionized water was used as the working medium to investigate the pool boiling heat transfer characteristics of smooth and microporous surfaces, thereby obtaining their pool boiling heat transfer curves. Results show that under identical heat flux conditions, the vaporization core of the microporous surface has a high density in the nucleate boiling zone, which can effectively reduce the superheat associated with the initial boiling point of the wall and considerably increase the pool boiling heat transfer coefficient. Thus, this study proves that the microporous surface of copper foam can be used for the heat dissipation of high-power electronic devices such as semiconductor refrigeration systems.