| Reliability Analysis of Sn-Bi Plating Chips |
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| 引用本文： | 帅迪,金星,郭士达,柳光洙. Reliability Analysis of Sn-Bi Plating Chips[J]. 上海交通大学学报, 2007, 0(Z2) |
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| 作者姓名： | 帅迪 金星 郭士达 柳光洙 |
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| 作者单位： | Samsung Electronics(Suzhou) Semiconductor Co.Ltd.，Samsung Electronics(Suzhou) Semiconductor Co.Ltd.，Samsung Electronics(Suzhou) Semiconductor Co.Ltd.，Samsung Electronics(Suzhou) Semiconductor Co.Ltd. Suzhou 215021，China，Suzhou 215021，China，Suzhou 215021，China，Suzhou 215021，China |
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| 摘 要： | Introduction The RoHS has published a law of lead-free,fromJuly 1,2006,all the EMproducts mustn’tcontain these deleterious things,such as Pb,Hg,Cd, 6Cr,PBB and PBDE.So most of SMDchange the Sn-Pb platinginto tin-plating.It’s reported that whisker is easily grown onthe surface of tin-plating chips(see Fig.1).Thelengthis from5~300μm.If the distance that be-tween two leads is shorter than 500μm,thewhisker may be connect the leads andlead to shortdefect.Some other metallic elements a…
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Reliability Analysis of Sn-Bi Plating Chips |
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| SHUAI Di,JIN Xing,GUO Shi-da,YU Kwangsu. Reliability Analysis of Sn-Bi Plating Chips[J]. Journal of Shanghai Jiaotong University, 2007, 0(Z2) |
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| Authors: | SHUAI Di JIN Xing GUO Shi-da YU Kwangsu |
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| Abstract: | The character of Sn-Bi plating chips,such as the effect of whisker preventing, solder ability,temperature cycle(T/C) test and thermal humidity bias(THB) test result was introduced.The research result shows that the Sn-Bi plating chips have good effect of prevent whisker from growing,these chips can pass the T/C test and THB test. |
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| Keywords: | Sn-Bi whisker solder ability thermal humidity bias(THB) |
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