利用微电铸制作镍悬臂梁

为了设计出导电的Ni微变截面悬臂梁，采用了基于成熟的电镀技术的微电铸工艺．在分析悬臂梁的变截面结构和搭建微电铸试验平台之后，设计了整个工艺流程，利用近紫外线厚胶光刻、Ni微电铸、去除牺牲层等工艺实现了悬臂梁的制作．工艺实验结果表明，整个变截面悬臂梁的铸层表面没有缺陷，但不同微电铸面积的基座、粗梁、细梁的铸层厚度不均匀，其中，铸层面积最大的基座铸层最厚，面积次之的粗梁的铸层厚度居中，面积最小的细梁的铸层最薄．实验证明在一定范围内增大占空比和降低电流密度可以抑制这种厚度不均匀现象．

Applying Micro-electroplating Technology to Fabricate Ni-cantilever

Micro-electroplating based on the mature electrodepositing technology was applied to design conductive Ni micro-cantilever with different cross-section. The structure of cantilever was analyzed and the microelectroplating platform was built. In the whole process flow,UV-lithography in thick photoresist, Ni-microelectroplating and the depleting of sacrificial layer were used to fabricate the cantilever. The experimental results show that film surface is flawless,hut the thicknesses of different areas of base, wide beam and narrow beam,are non-uniform. The widest base has the highest electroplating thickness ; the thickness of the narrow beam is thinnest; and the thickness of the wide beam is in the middle of two formers. But this non-uniform phenomenon can be restrained by increasing the duty cycle and reducing the current density in a limited scope.