| ZnO陶瓷键合Cu电极技术的研究 |
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| 引用本文： | 谢进 徐传骧. ZnO陶瓷键合Cu电极技术的研究[J]. 西安交通大学学报, 1997, 31(4): 18-22,36 |
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| 作者姓名： | 谢进 徐传骧 |
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| 作者单位： | 西安交通大学 |
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| 基金项目： | 国家教委博士点基金,上海交通大学金属基复合材料国家重点实验室资助 |
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| 摘 要： | 研究了Ｃｕ－ＺｎＯ陶瓷键合技术，并探讨了其作为电极用在线性ＺｎＯ陶瓷电阻器上对器件性能的影响，运用扫描电镜对Ｃｕ－ＺｎＯ陶瓷的键合结构进行了分析，测量了键合Ｃｕ电极后的接触电阻及器件耐电流冲击的稳定性，并与镀Ｃｕ、喷Ａｌ及烧Ａｇ电极进行了分析对比。同时，研究了键合Ｃｕ电极的工艺对ＺｎＯ陶瓷本体电阻产生的影响。
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| 关 键 词： | 键合 电极 氧化锌陶瓷 铜 附着力 |
Study of the Technique of Bonding Copper to ZnO Ceramic Used as an Electrode |
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| Xie Jin Xu Chuanxiang Li Shengtao. Study of the Technique of Bonding Copper to ZnO Ceramic Used as an Electrode[J]. Journal of Xi'an Jiaotong University, 1997, 31(4): 18-22,36 |
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| Authors: | Xie Jin Xu Chuanxiang Li Shengtao |
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| Abstract: | The technique of bonding copper to ZnO ceramic used as an electrode has been studied. The influences on the function of liner ZnO resistor by using this electrode are discussed. Bonding structure of Cu ZnO ceramic is investigated by Scanning Electron Microscope (SEM). The contact resistance and the stability of resisting to pulse current for a copper bonded electrode are measured and analysed by comparing with copper plating, aluminium spraying, and silver sintering electrode. The influence on the resistance of ZnO ceramic by the copper bonding technology has also been studied. |
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| Keywords: | copper ZnO ceramic resistor bonding electrode |
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