| 铝与钠玻璃阳极焊的电场特性研究 |
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| 引用本文： | 蔚晓嘉.铝与钠玻璃阳极焊的电场特性研究[J].西安交通大学学报,2000,34(1):62-65. |
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| 作者姓名： | 蔚晓嘉 |
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| 作者单位： | 西安交通大学,710049,西安 |
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| 摘 要： | 通过有限元分析，计算了不同工艺条件下阳极焊界面处电场强度的分布和大小，结果表明：界面处微观区域内总存在一个最大场强值，其电场强度最大值点在界面处的阴极表面凸上，当量大场强值与研究材料击穿电压为同一数量级时，可引起局部击穿，从而促使离子扩散，阳极焊。
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| 关 键 词： | 阳极焊 界面 电场 铝 钠玻璃 |
| 文章编号： | 0253-987X（2000）01-0062-04 |
| 修稿时间： | 1999-03-04 |
Anodic Bonding of Aluminum to Glass |
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| Wei Xiaojia.Anodic Bonding of Aluminum to Glass[J].Journal of Xi'an Jiaotong University,2000,34(1):62-65. |
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| Authors: | Wei Xiaojia |
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| Institution: | Wei Xiaojia;
(Xi |
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| Abstract: | The interface electric field for anodic bonding is calculated for different conditions by the finite elements analysis. At least one maximum for the field is found to prevail at the microcosmic region at the interface. This is local to the highest point of negative surface. When the maximum value is of the same order of magnitude to the local striking off voltage, then ionic diffusion in anodic bonding could take place. |
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| Keywords: | Anodic bonding interface electric field |
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