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高性能铜铝复合排的制备及界面研究
引用本文:廖文俊,刘新宽,王宇鑫.高性能铜铝复合排的制备及界面研究[J].同济大学学报(自然科学版),2012,40(8):1234-1238.
作者姓名:廖文俊  刘新宽  王宇鑫
作者单位:1. 同济大学材料科学与工程学院,200092;上海电气集团股份有限公司中央研究院,200070
2. 上海理工大学材料科学与工程学院,200093
3. 同济大学材料科学与工程学院,200092
摘    要:采用固-液法浇注和铸轧工艺制备铝/铜复合材料.研究不同工艺对铜/铝复合排界面结合强度的影响,并对铜/铝复合排界面结构和复合机理进行分析.结果表明:当进行300°C×1h热处理时,所得复合排的结合强度最高,多次热循环后复合排界面结合强度有所增加.电子探针能谱扫描分析(EDS)和X射线衍射分析(XRD)表明铜/铝复合界面上生成金属间化合物Al2Cu,Al4Cu9和AlCu相,从而使得界面层硬度增大.采用该方法制备的铜/铝复合排,整体拉伸强度达98MPa,电阻率为0.021 6×10-6Ω.m.

关 键 词:铜/铝复合排  界面强度  过渡层  复合机理
收稿时间:2011/5/25 0:00:00
修稿时间:2011/10/19 0:00:00

Study on preparation and interface of high-performance Cu-Al composite row
liaowenjun,liu xinkuan and wang yuxin.Study on preparation and interface of high-performance Cu-Al composite row[J].Journal of Tongji University(Natural Science),2012,40(8):1234-1238.
Authors:liaowenjun  liu xinkuan and wang yuxin
Institution:1(1.College of Materials Science and Engineering,Tongji University,Shanghai 200092,China;2.Shanghai Electric Group Co.Ltd.,Central Academe,Shanghai 200070,China;3.School of Materials Science and Engineering,University of Shanghai for Science and Technology,Shanghai 200093,China)
Abstract:Cu-Al composite row was prepared by solid-liquid bonding method and cast-rolling technique.Different processes affecting interfacial strength were studied.The interface structure and bonding mechanism of Cu-Al composite row were analyzed.The results show that when the heat treatment temperature is 300℃,for 1h,the interfacial bonding strength is the highest.The bonding strength increases after multiple thermal cycling.Energy Dispersive Spectroscopy(EDS) and X-ray Diffraction(XRD) analysis show that the interface diffusion layer generates the intermetallic compounds Al2Cu,AlCu and Al4Cu9 phase,which increase the interfacial hardness.Cu-Al composite row prepared by this method has excellent mechanical properties and electrical conductivity;the tensile strength reaches 98 MPa;the resistance rate is 0.0216 × 10-6 Ω·m.
Keywords:Cu Al composite row  interfacial strength  transition layer  bonding mechanism
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