| Properties of the Environmental-Friendly Si/Al Composite for Electronic Packages Fabricated by Squeeze Casting Technology |
| |
| 作者姓名： | 武高辉 修子扬 张强 |
| |
| 作者单位： | School of Materials Science and Eng. Harbin Institute of Technology，School of Materials Science and Eng.，Harbin Institute of Technology，School of Materials Science and Eng.，Harbin Institute of Technology，Harbin 150001，China，Harbin 150001，China，Harbin 150001，China |
| |
| 摘 要： | Introduction The electronic packaging materials were main-ly used to providing mechanical support,airproofprotect and electronic apparatus thermal dissipa-ting1-3].With the development of computer,theaeronautics and astronautics and the military com-muni…
|
Properties of the Environmental-Friendly Si/Al Composite for Electronic Packages Fabricated by Squeeze Casting Technology |
| |
| WU Gao-hui,XIU Zi-yang,ZHANG Qiang.Properties of the Environmental-Friendly Si/Al Composite for Electronic Packages Fabricated by Squeeze Casting Technology[J].Journal of Shanghai Jiaotong University,2007(Z2). |
| |
| Authors: | WU Gao-hui XIU Zi-yang ZHANG Qiang |
| |
| Abstract: | |
| |
| Keywords: | Si particles aluminum matrix composite thermal expansion thermal conductivity |
| 本文献已被 CNKI 等数据库收录！ |
