| LTCC多层互连基板布线布局电磁兼容性研究 |
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| 引用本文： | 安宁.LTCC多层互连基板布线布局电磁兼容性研究[J].科学技术与工程,2012,12(20):4906-4911,4920. |
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| 作者姓名： | 安宁 |
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| 作者单位： | 中国空空导弹研究院,洛阳,471000 |
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| 摘 要： | 低温共烧陶瓷（LTCC）多层互连基板电磁兼容性问题直接影响多层板布线及芯片布局。本文采用商用三维电磁场仿真软件和电路仿真软件对多种互连结构分别进行电磁耦合特性及信号完整性分析和仿真，并根据仿真结果提出了抑制干扰的方法，得到了多层板布线布局的规律。
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| 关 键 词： | 低温共烧陶瓷 多层互连结构 电磁耦合 信号完整性 |
| 收稿时间： | 3/28/2012 9:44:38 PM |
| 修稿时间： | 3/28/2012 9:44:38 PM |
Research in the EMC of LTCC Multilayer Interconnect Substrate Layout |
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| anning.Research in the EMC of LTCC Multilayer Interconnect Substrate Layout[J].Science Technology and Engineering,2012,12(20):4906-4911,4920. |
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| Authors: | anning |
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| Institution: | (China Airborne Missile Academy,Luoyang 471009,P.R.China) |
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| Abstract: | EMC of the low temperature cofired ceramic (LTCC) multilayer interconnect substrate influence the multilayer substrate layout directly. In this work, the three-dimensional electromagnetism software and circuit software are used to simulate the characteristic of electromagnetism coupling and signal integrity respectively. By the simulated results, the influence of interference and the rule of multilayer substrate layout are obtained. |
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| Keywords: | LTCC multilayer interconnect substrate electromagnetism coupling signal integrity |
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