杂质元素及加工工艺对无氧铜接触线性能的影响

通过对引进上引法无氧圆铜杆生产线的技术改造,试制了无氧铜接触线,并研究了杂质元素及加工工艺对无氧铜接触线性能的影响·结果表明:Fe含量对无氧铜接触线电阻率影响较大,当w(Fe)超出20×10-6～30×10-6时,电阻率超标;S,O,H含量对其强度及电阻率影响不大,但对其塑性影响较大,当w(S)超过38×10-6,w(O)超过8×10-6,w(H)超过0 6×10-6时,无氧铜接触线塑性显著下降·S含量取决于电解铜原料,Fe,O,H含量取决于上引法连铸的生产工艺过程·生产中应选择优质电解铜原料,严细操作,并对一切与铜液接触的原辅材料和器具进行干燥或烘烤,同时应对熔化炉、保温炉、流槽进行覆盖保护...

Effects of Impurities and Process Technology on Properties of Oxygen-Free Copper Contact Wire

The effects of impurities and process technology on the properties of oxygen-free copper contact wire were studied. The results showed that the resistivity of contact wire is affected by Fe evidently and will become unqualified when w[Fe] exceeds 20×10^-6-30×10^-6. On the other hand, the contents of S, H and O affect the tensile strength and resistivity unobviously, but affect the plasticity evidently. The plasticity will lower when w[S], w[O] or w[H] exceeds 38×10^-6, 8×10^-6 or 0.6×10^-6, respectively. The S content depends on the electrolytic copper as raw material, while the Fe, O, and H contents depend on the process technology. It implies that quality electrolytic copper should be chosen in combination with careful operation and both the raw and ancillary materials, and devices to use should be dried or baked up. In addition, the melting furnace, holding furnace and launder should all be covered and deoxidized to prevent the molten copper from oxidizing and suction.