废旧电路板中金的碘化法回收工艺

针对电路板中金的回收问题,提出粉碎—浮选—碘化浸出工艺。采用浮选法对经粉碎分级的电路板粉末进行分选实验,分选出的金属粉末用硝酸去除贱金属,过滤,由碘化法浸出滤渣中的金。实验结果表明:电路板中金属和非金属完全解离粒度为0.450 mm;浮选分离小于0.450 mm电路板粉末,沉物金属质量分数为87.32%,金属回收率为90.11%;碘和碘化物溶液可以在3 h内有效浸出电路板粉末中的金,金浸出率为95.53%。

Gold recovery process with iodine method from waste printed circuit board

Aimed at recovering gold from waste printed circuit board,this paper proposes a crush-flotation-iodide leaching process.The process consists of crushing and classifying the waste printed circuit board,separating each particle size powder into metallic and nonmetallic,removing the base metal in metallic powder by nitric acid leaching,filtration,and recovering gold in the residue with iodine leaching method.Results show that metals and non-metals in the printed circuit boards exhibit a complete dissociation granularity of 0.450 mm,the separation of less than 0.450 mm printed circuit board powder by flotation process yields a mass fraction of sediment metals of 87.32%,and metal recovery of 90.11%,and the iodine and iodide solutions gives effective leaching of the gold in the printed circuit boards powder within 3 h,with a leaching rate of 95.53%.