电纺碳纳米纤维短纤增强的高介电常数聚酰亚胺复合材料

通过碳化电纺纳米纤维研磨和超声破碎制备碳纳米纤维短纤(SCNFs),并用作填料制备碳纳米纤维短纤/聚酰亚胺(SCNFs/PI)复合材料.研究了SCNFs/PI复合材料的介电性能和力学性能.结果表明:SCNFs既对这种复合材料的机械性能具有显著的改善,也是制备高介电常数复合材料的良好导电填料.与纯PI相比,含 SCNFs质量分数为1%复合材料的抗拉伸强度提升了 39.43%; 同时,这个复合材料也显示了一个质量分数为4%的SCNFs低渗流阈值,此时的介电常数为60.79@100 Hz.这些电纺碳纳米纤维短纤增强的PI复合材料有望作为高性能介电材料在现代电子器件行业中得到良好应用.

The High Dielectric Permittivity Composites of Polyimide and Short Electrospun Carbon Nanofibers

The high dielectric permittivity composites are prepared by using short carbon nanofibers(SCNFs)as fillers mixed in polyimide(PI)matrix.The SCNFs are obtained by electrospinning followed with grinding and ultrasonic breaking.The dielectric and mechanical performances of the SCNFs-filled polyimide(SCNFs/PI)composites are investigated.The measurement results show that the SCNFs significantly improve the mechanical performances and are good conductive fillers for preparing the high dielectric permittivity composites.Compared with neat polyimide,the composites containing 1wt% SCNFs have a more than 39% improvement in tensile strength.The SCNFs/PI composites have a low percolation threshold of 4wt% for the dielectric permittivity(60.79@100 Hz).These SCNFs/PI composites can be good candidates for making high performance dielectric materials for modern electronic applications.