| 金属钨表面电镀的研究 |
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| 引用本文： | 洪祥乐.金属钨表面电镀的研究[J].佛山科学技术学院学报(自然科学版),1999,17(3):1-5. |
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| 作者姓名： | 洪祥乐 |
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| 作者单位： | 佛山科学技术学院,化学与化工系,广东,佛山,528000 |
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| 摘 要： | 研究了钨表面镀前处理及预镀铬、镍，然后镀金的工艺条件，并测定了镀层性能，获得了结合力好，可焊性好的镀层。
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| 关 键 词： | 钨 表面电镀 镀层结合力 镀层可焊性 |
A study on the surface electroplating of metallic tungsten |
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| HONG Xiang-le.A study on the surface electroplating of metallic tungsten[J].Journal of Foshan University(Natural Science Edition),1999,17(3):1-5. |
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| Authors: | HONG Xiang-le |
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| Abstract: | The paper studied the pre treatment for electroplating the surface of tungsten and technical conditions for chromate treatment, nickel and gold plating, determined the functions of cladding material. The cladding material were obtained with satisfactory binding force and welding feasibility. |
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| Keywords: | tungsten surface electroplating binding force of cladding material welding feasibility |
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