| 双脉冲电位法制备铜镍层状结构材料 |
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| 引用本文： | 薛江云,吴继勋.双脉冲电位法制备铜镍层状结构材料[J].北京科技大学学报,1996,18(5):482-485. |
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| 作者姓名： | 薛江云 吴继勋 |
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| 作者单位： | 北京科技大学表面科学与腐蚀工程系 |
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| 摘 要： | 采用旋转圆盘电极，用双脉冲电位法从简单的镀液中电沉积Ｃｕ－Ｎｉ层状材料，研究了镀液中铜含量、添加剂、转速对镀层的组成和结构的影响，并用扫描电镀和Ｘ－射线衍射研究了镀层的形貌和组成。
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| 关 键 词： | 铜镍合金 层状结构材料 电镀 双脉冲电位法 |
Electrodeposition of Cu-Ni Layered Films by Dual Potential Pulse Method |
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| Xue Jiangyun, Wu Jixun, Yang De.Electrodeposition of Cu-Ni Layered Films by Dual Potential Pulse Method[J].Journal of University of Science and Technology Beijing,1996,18(5):482-485. |
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| Authors: | Xue Jiangyun Wu Jixun Yang De |
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| Abstract: | A method has been developed to produce Cu-Ni composition-modulated alloys from a simple electrolyte by electrodeposition.The effects of the concentration of copper ions,additives and the speed of rotation were investigated.The results were analysed by SEM and X-ray diffraction.The result indicated that the film was alternating pure copper and copper-nickel alloy layers.If the content of copper in nickel layer is to be small, the concentration of its ions in solution must be small and the rotation speed must be low. |
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| Keywords: | electro-deposition copper-nickel alloy layer structure material |
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