降低固-固界面热阻方法研究进展

降低固-固界面热阻法是一种高效且应用广泛的减小器件传热阻力的方法。根据固-固界面状态增加界面的有效接触，可强化界面热传导。首先，概述了固-固界面热阻的产生机理；其次，梳理了界面状态（平面接触和沟槽接触）、粗糙度、界面压力、热界面材料等固-固界面热阻影响因素的作用机制；第三，介绍了降低固-固界面热阻方法的最新进展；最后，分析了降低固-固界面热阻研究存在的问题，并对其研究前景进行了展望，提出未来应从界面结构、压力/平面度、固-固接触材料本身的物性参数、超薄黏合层热界面材料等单独或共同作用的方向上深化降低界面热阻的研究，为其在强化电子散热领域的应用提供理论和实验支持。

Research progress of methods to reduce solid-solid contact thermal resistance

Reducing solid-solid interface contact thermal resistance is an efficient and widely used method for reducing heat transfer resistance in devices. Increasing the effective contact of the interface according to the solid-solid interface state can enhance the interface heat conduction. Firstly, the mechanism of solid-solid interface thermal resistance was summarized. Secondly, the mechanism of the factors affecting the solid-solid interface thermal resistance was investigated, such as interface state(plane contact and groove contact), roughness, interface pressure, thermal interface material, etc. Thirdly, the latest progress of methods to reduce the contact thermal resistance of solid-solid interface was introduced. Finally, the problems in the research of reducing the contact thermal resistance of solid-solid interface were analyzed and its development prospect was suggested as following: further research should be carried out alone or together in the direction of the interface structure, pressure/flatness, physical parameters of solid-solid contact materials and thermal interface materials with ultra-thin boundary layer thickness, etc. It provides theoretical and experimental support for the application in the field of enhanced electronic cooling.