| Abnormal growth of Ag3Sn intermetalUc compounds in Sn-Ag lead-free solder |
| |
| 作者姓名： | SHEN Jun LIU Yongchang GAO Houxiu |
| |
| 作者单位： | [1]College of Mechanical Engineering, Chongqing University, Chongqing 400044, China [2]College of Materials Science ＆ Engineering, Tianjin University, Tianjin 300072, China |
| |
| 基金项目： | Acknowledgements This work was supported by the National Natural Science Foundation of China （Grant No. 50401033） and the Liu Hui Applied Mathematics Center of Nankai University and Tianjin University （Grant No. T13）. |
| |
| 摘 要： |
|
| 关 键 词： | 无铅焊料 金属间化合物 示差热分析 纳米相 Ag3Sn |
| 收稿时间： | 2005-12-27 |
| 修稿时间： | 2005-12-272006-02-09 |
Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder |
| |
| SHEN Jun LIU Yongchang GAO Houxiu.Abnormal growth of Ag3Sn intermetalUc compounds in Sn-Ag lead-free solder[J].Chinese Science Bulletin,2006,51(14):1766-1770. |
| |
| Authors: | Jun Shen Yongchang Liu Houxiu Gao |
| |
| Institution: | (1) College of Mechanical Engineering, Chongqing University, Chongqing, 400044, China;(2) College of Materials Science & Engineering, Tianjin University, Tianjin, 300072, China |
| |
| Abstract: | The abnormal growth of Ag3Sn intermetallic compounds in eutectic Sn-3.5% Ag solder was investigated through high-temperature aging treatment. Microstructural evolutions of this solder before and after the aging treatment were observed by optical microscopy and scanning electron microscopy. Precise differential thermal analysis was made to study the changes in enthalpies of the solder under different conditions. The results reveal that the water-cooled solder is in metastable thermodynamic state due to the high free energy of Ag3Sn nanoparticles, which sporadically distribute in the matrix as second-phase. The second-phase Ag3Sn nanoparticles aggregate rapidly and grow to form bulk intermetallic compounds due to the migration of grain boundary between primary Sn-rich phase and the Ag3Sn nanoparticles during high temperature aging treatment. |
| |
| Keywords: | lead-free solder intermetallic compounds differential thermal analysis nanophase |
| 本文献已被 维普 SpringerLink 等数据库收录！ |
| 点击此处可从《中国科学通报(英文版)》浏览原始摘要信息 |
| 点击此处可从《中国科学通报(英文版)》下载免费的PDF全文 |
