| 焊补过程温度场的有限元法计算机模拟 |
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| 引用本文： | 陈星明 钱翰城. 焊补过程温度场的有限元法计算机模拟[J]. 重庆邮电学院学报(自然科学版), 2000, 12(2): 27-30 |
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| 作者姓名： | 陈星明 钱翰城 |
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| 作者单位： | 重庆大学机械工程学院!重庆，400044，重庆大学机械工程学院!重庆，400044 |
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| 摘 要： | 开发了一种用于温度场模拟的有限元微机软件 ,实测结果证实了软件模拟的准确性。运用该软件的模拟结果分析了铸件溶解扩散焊的热影响区硬度升高的原因并给出了解决该问题的途径。
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| 关 键 词： | 有限元 计算机模拟软件 焊接温度场 铸件 |
Computer Simulation of Temperature Field During the Welding Process |
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| CHEN Xing ming QIAN Han cheng. Computer Simulation of Temperature Field During the Welding Process[J]. Journal of Chongqing University of Posts and Telecommunications(Natural Sciences Edition), 2000, 12(2): 27-30 |
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| Authors: | CHEN Xing ming QIAN Han cheng |
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| Abstract: | The common finite element method microcomputer software for simulation of the temperature field is developed by authors. Its correctness is proved by testing results.This software is used to analyze the causes of hardness rising in heat effecting zone, and finally the approach to solving the problem is presented. |
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| Keywords: | finite element methods computer simulation welding temperature field |
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