| 齿轮加工破裂分析 |
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| 引用本文： | 周善民.齿轮加工破裂分析[J].江西科学,1988(1). |
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| 作者姓名： | 周善民 |
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| 作者单位： | 南昌航空工业学院 南昌 |
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| 摘 要： | 本文研究了用EPM-810Q电子探针和PV9100型能谱仪对机床齿轮加工中呈现的裂缝断口进行了二次电子图像观察,同时对微区夹杂物中Si、S、Mn、P元素进行了X射线的面扫描及微区点的定量计算。从而得出了齿轮破裂是由于硅酸盐和硫化物夹杂所造成的。
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| 关 键 词： | 机床齿轮加工 破裂分析 电子探针 二次电子图象 |
ON CRACK IN WHEEL WORKING |
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| Zhou Shanmin.ON CRACK IN WHEEL WORKING[J].Jiangxi Science,1988(1). |
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| Authors: | Zhou Shanmin |
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| Institution: | Nanchang Institute of Aeronautical Engineer |
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| Abstract: | Crack in wheel making were studied, by using the electron prob micro-analyzer EPM-810Q and EDAX PV-9100, the secondary electron image of crack was observed.At the same time, X-ray area scanning and quanti-tatiue microanalysis for silicon, surphor phosphorus and manganese in the microporphyritic inclutions were conducted. The wheel working crack was considered due to silicate and sulphide inclutions. |
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| Keywords: | Electron prob Secondary electron image Crack analysis Wheel working |
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