碱溶性光敏树脂保护层的产生与消除方法

提出一种手机磨头电镀过程中非电镀位置碱溶性光敏树脂保护层的产生与消除的方法.首先,用毛刷在工件上涂一层厚度为194~366 μm的碱溶性光敏树脂;其次,在80 ℃电阻炉内表面干燥40 min,然后,在工件需要保护的部分用紫外线照射固化50 s,工件需要电镀的部分无需照射,用质量分数为3%的Na₂CO₃溶液冲洗工件5 min,未被照射的部分树脂被去除,固化率为99.48%.最后,用质量分数为10%的NaOH溶液把保护层全部去除.结果表明:这种保护层产生及去除的方法成本低、效率高、环保,具有很好的发展前景.

Generation and Elimination Method of Shield Layer Made by Alkali Soluble Photosensitive Resin

A new method of the generation and elimination of protective layer has been proposed in this study. Firstly, the workpiece was brushed with a layer of alkali soluble photosensitive resin, with thickness range from 194 to 366 μm. Secondly, the workpiece was dried in the resistance furnace, with temperature of 80 ℃ and drying time of 40 min. Then the ultraviolet was used to cure the part of the workpiece which needed protection 50 s, and the part which needed to be plated avoid irradiating. The workpiece was rinsed by the Na₂CO₃ solution with mass fraction of 3% for 5 min, and the part not irradiated was removed. The curing degree was calculated as 99.48%. Finally, the protective layer was completely removed by the NaOH solution with mass fraction of 10%. The results showed that the method of the generation and elimination of protective layer is characterized by low cost, high efficiency and environmental protection.