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| Low melting point nanocrystalline Sn–Ag solder synthesized by a refined chemical reduction method | |
| 基金项目： | supported by the National Natural Science Foundation of China(50971086,51171105) |
| 摘 要： | The commercial market of Sn-Pb solder is gradually decreasing due to its toxicity, calling for Pb-free substitute materials. Sn-Ag alloy is a potential candidate in terms of good mechanical property. The major problematic issue of using Sn-Ag is their high melting temperature, consequently this study is dedicated to lowering the melt- ing temperature of Sn3.5Ag （wt%） alloy by developing nanomaterials using a chemical reduction approach. The resultant nanocrystalline Sn3.5Ag is characterized by field emission scanning electron microscope. The size dependence of the melting temperature is discussed based on differential scanning calorimetry results. We have reduced the melting temperature to 209.8 ℃ in the nanocrystalline Sn3.5Ag of （32.4± 8.0） nm, compared to ～221 ℃ of the bulk alloy. The results are consistent with the prediction made by a relevant theoretical model, and it is possible to further lower the melting temperature using the chemical reduction approach developed by this study. |
| 关 键 词： | 还原方法 纳米晶 化学 焊料 场发射扫描电子显微镜 低熔点 差示扫描量热法 熔化温度 |
Low melting point nanocrystalline Sn–Ag solder synthesized by a refined chemical reduction method |
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| Authors: | Bingge Zhao Weipeng Zhang Changdong Zou Qijie Zhai Steve F A Acquah Yulai Gao |
| Institution: | 1. Shanghai Key Laboratory of Modern Metallurgy and Materials Processing, Shanghai University, Shanghai, 200072, China 2. Laboratory for Microstructures, Shanghai University, Shanghai, 200436, China 3. Department of Chemistry and Biochemistry, Florida State University, Tallahassee, FL, 32306, USA |
| Abstract: | The commercial market of Sn–Pb solder is gradually decreasing due to its toxicity, calling for Pb-free substitute materials. Sn–Ag alloy is a potential candidate in terms of good mechanical property. The major problematic issue of using Sn–Ag is their high melting temperature, consequently this study is dedicated to lowering the melting temperature of Sn3.5Ag (wt%) alloy by developing nanomaterials using a chemical reduction approach. The resultant nanocrystalline Sn3.5Ag is characterized by field emission scanning electron microscope. The size dependence of the melting temperature is discussed based on differential scanning calorimetry results. We have reduced the melting temperature to 209.8 °C in the nanocrystalline Sn3.5Ag of (32.4 ± 8.0) nm, compared to ~221 °C of the bulk alloy. The results are consistent with the prediction made by a relevant theoretical model, and it is possible to further lower the melting temperature using the chemical reduction approach developed by this study. |
| Keywords: | Sn Ag particles Nanomaterial Melting point reduction Chemical reduction method |
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