| 半固态触变压射成形过程模拟及验证 |
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| 引用本文： | 崔成林,毛卫民,赵爱民,钟雪友. 半固态触变压射成形过程模拟及验证[J]. 北京科技大学学报, 2001, 23(3): 237-239 |
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| 作者姓名： | 崔成林 毛卫民 赵爱民 钟雪友 |
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| 作者单位： | 北京科技大学材料科学与工程学院, |
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| 基金项目： | 国家高技术研究发展计划(863计划);714-012-004; |
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| 摘 要： | 根据触变铸造半固态合金的流变特性，将半固态触变成形过程的流动简化为均相等温层流流动，并对其进行了数值模拟和实验验证，数值模拟结果与实验充型结果基本相符。
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| 关 键 词： | 数值模拟 半固态触变压射成形 铸造工艺 触变铸造 半固态合金 |
| 修稿时间： | 2001-01-16 |
Verification and Numerical Simulation for Semi-solid Modeling the Thixoforming Process |
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| CUI Chenglin,MAO Weimin,ZHAO Aimin,ZHONG Xueyou. Verification and Numerical Simulation for Semi-solid Modeling the Thixoforming Process[J]. Journal of University of Science and Technology Beijing, 2001, 23(3): 237-239 |
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| Authors: | CUI Chenglin MAO Weimin ZHAO Aimin ZHONG Xueyou |
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| Abstract: | Based on floe-varying characteristics of thixotropic casting semisolid alloys, the flowing state of the semisolid alloy and the procedures as filling up the mould by means of thixotropic casting being per- formed, is simplified to the flow which features in an equal temperature layers, audit also is simulated and verified. The analogical results corresponds to that of filling up mould. |
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| Keywords: | semisolid alloys thixoforming numerical simulation |
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