| 仿真技术在半导体老化板计算中的应用 |
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| 引用本文： | 杜先东.仿真技术在半导体老化板计算中的应用[J].科技信息,2009(1). |
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| 作者姓名： | 杜先东 |
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| 作者单位： | 苏州大学计算机科学与技术学院; |
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| 摘 要： | 老化测试是半导体封测阶段中非常重要的一个环节,但由于老化测试本身所具有时间不确定性,以及半导体生产中的诸多随机性因素,导致老化测试板的需求计算非常困难。如何比较准确地计划老化测试板的需求,既能保证生产的正常进行,又可以避免不必要的成本支出,已经成为半导体生产厂商们日益关注的问题。本文结合实例,通过仿真软件对某一内存厂商的老化测试工序进行初步研究,来说明计算机仿真手段在半导体老化测试板需求计算中的作用。
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| 关 键 词： | 计算机仿真 仿真建模 制造工艺流程 老化测试 |
Simulation Technology Application in Semiconductor Burn In Board Calculation |
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| Du Xian-dong.Simulation Technology Application in Semiconductor Burn In Board Calculation[J].Science,2009(1). |
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| Authors: | Du Xian-dong |
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| Institution: | Computer Science and Technology Institute;Soochow University Suzhou 211600 |
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| Abstract: | Burn in test is a very important process in semiconductor assembly and test phase,but because of the flexible burn in test time and many randomness factors in semiconductor production,it's very difficult to calculate the actual burn in board requirement. How to get the accuracy burn in board requirement,to assure the normal production and avoid the unnecessary cost expense have become more and more attend issue in semiconductor manufacturers. This paper will base actual sample,using simulation software to d... |
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| Keywords: | Computer Simulation Simulation Modeling Manufacturing Process Flow Burn In Test |
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