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Reactive ion etching of poly(vinylidene fluoride-trifluoroethylene) copolymer for flexible piezoelectric devices |
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| Authors: | YongGang Jiang Syohei Shiono Hiroyuki Hamada Takayuki Fujita DeYuan Zhang Kazusuke Maenaka |
| Institution: | 15836. School of Mechanical Engineering and Automation, Beihang University, Beijing, 100191, China 25836. Graduate School of Engineering, University of Hyogo, Himeji, 671-2280, Japan 35836. Maenaka Human-Sensing Fusion Project, ERATO, Japan Science and Technology Agency, Himeji, 671-2280, Japan |
| Abstract: | A microfabrication process for poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) based flexible piezoelectric devices is proposed using heat controlled spin coating and reactive ion etching (RIE) techniques. Dry etching of P(VDF-TrFE) in CF4+O2 plasma is found to be more effective than that using SF6+O2 or Ar+O2 feed gas with the same radiofrequency power and pressure conditions. A maximum etching rate of 400 nm/min is obtained using the CF4+O2 plasma with an oxygen concentration of 60% at an antenna power of 200 W and a platen power of 20 W. The oxygen atoms and fluorine atoms are found to be responsible for the chemical etching process. Microstructuring of P(VDF-TrFE) with a feature size of 10 μm is achieved and the patterned films show a high remanent polarization of 63.6 mC/m2. |
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