光电互联PCB随机振动响应分析

研究随机振动对光电互联PCB可靠性的影响.在其产品概念设计阶段，建立光电互联PCB的三维有限元模型，对4点固支条件下获得的光电互联PCB模态参数进行研究.分析表明1、2阶频率差值和4、5阶频率差值较小，相邻阶之间容易发生多阶共振现象.在GJB150.16-86试验条件下采用分块兰索斯法对光电互联PCB进行随机振动响应分析，重点关注随机振动载荷对光电互联PCB翘曲度、焊点可靠性、光耦合效率和光纤带可靠性的影响. 

Analysis on Random Vibration Response of Photoelectric PCB

The influence of random vibration on optoelectronic PCB reliability was analyzed. In the product conceptual design stage, a three-dimensional finite element model of photoelectric PCB was established. Photoelectric PCB mode parameters which obtained under the four-point fixed condition were studied. Result shows that the frequency difference between the 1st and the 2nd order, or between the 4th and the 5th order is small, and the multi-order resonance phenomenon is likely to occur between the adjacent orders. The random vibration response analysis under dynamic environment which defined by GJB 150.16-86 was carried out using the Block Lanczos method. Especially, the research focused on the impact of random vibration load on optoelectronic PCB, including the warpage of optoelectronic PCB, solder joints reliability, optical coupling efficiency and optical fiber reliability.