| 化学镀Ni-W-P合金层镀覆工艺的研究 |
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| 引用本文： | 陈钰秋,陈克明. 化学镀Ni-W-P合金层镀覆工艺的研究[J]. 华中科技大学学报(自然科学版), 1998, 0(1) |
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| 作者姓名： | 陈钰秋 陈克明 |
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| 作者单位： | 华中理工大学材料科学与工程系!430074(陈钰秋)，冶金部钢铁研究总院(陈克明) |
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| 摘 要： | 研究了镀液pH值、主盐浓度比（[WO42-]／[Ni2+]）、络合剂及稳定剂浓度对化学镀Ni-W-P合金层W及P含量的影响．结果表明，络合剂对其影响受镀液中主盐钨酸钠含量的控制，欲获得具有高W和P含量的镀层，必须在提高络合剂浓度的同时，按一定比例提高钨酸钠浓度．
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| 关 键 词： | 化学镀 Ni-W-P 工艺 |
Investigation on the Process of Electroless Plating of Ni-W-P Alloy Deposits |
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| Chen Yuqiu,Chen Keming. Investigation on the Process of Electroless Plating of Ni-W-P Alloy Deposits[J]. JOURNAL OF HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY.NATURE SCIENCE, 1998, 0(1) |
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| Authors: | Chen Yuqiu Chen Keming |
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| Affiliation: | Chen Yuqiu;Chen Keming |
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| Abstract: | The effects from pH value of the bath, ratio of the concentration of main salts ([WO42-]/[Ni2 +]) , the complexing agents and the stabilizers on the content of tungsten and phosphorus in Ni-W-P alloy deposit by electroless plating are studied. The result shows that the effect of the complexing agent is closely related to the concentration of thc Na2WO4. The concentration of the NaWO4 must be increased in proper proportion at the same time when the concentration of the complexing agent is increased in order to obtain an alloy deposit of high tungsten and high phosphorus contents. |
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| Keywords: | electroless platlng Ni-W-P process |
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