首页 | 本学科首页   官方微博 | 高级检索  
     

聚脲体系辣素微胶囊的界面聚合法制备与热降解动力学
引用本文:韩维涛,焦剑岚,李亚男. 聚脲体系辣素微胶囊的界面聚合法制备与热降解动力学[J]. 河北师范大学学报(自然科学版), 2006, 30(6): 673-677
作者姓名:韩维涛  焦剑岚  李亚男
作者单位:防化研究院第4研究所,北京,102205;防化研究院第4研究所,北京,102205;防化研究院第4研究所,北京,102205
摘    要:在乳液体系中,以聚脲为壁材,以界面聚合法制备了包裹辣素同系物--N-香草基壬酰胺的微胶囊.通过正交实验确定了获得较好包埋率的反应条件:反应温度50℃、乳化值8、乳化转速2000 r/min.红外光谱对照显示囊心与形成壁材的单体间存在键合;吸附等温曲线为标准Ⅰ类曲线,并由此假设微胶囊为紧密堆积形式,以单个扫描速率升温法进行了微胶囊的热降解实验,采用Freeman-Caroll方法与Achar-Brindley-Sharp-Wendworth方法进行了热重数据的处理,求得了动力学参数,回归系数显示这2种处理方法所获得的反应级数一致.

关 键 词:聚脲  微胶囊  界面聚合  热降解动力学
文章编号:1000-5854(2006)06-0673-05
收稿时间:2005-12-13
修稿时间:2006-01-24

Interfacial Polymerization Preparation and Thermal Decomposition Kinetics of Polyurea Microencapsules Containing Capsaicine
HAN Wei-tao,JIAO Jian-lan,LI Ya-nan. Interfacial Polymerization Preparation and Thermal Decomposition Kinetics of Polyurea Microencapsules Containing Capsaicine[J]. Journal of Hebei Normal University, 2006, 30(6): 673-677
Authors:HAN Wei-tao  JIAO Jian-lan  LI Ya-nan
Affiliation:The Quartus Research Institute,Chemical Defense Aeademy,Beijing 102205,China
Abstract:Polyurea microencapsules containing N-pelargonylvanillylamide, the homolog ot capsaicine, were prepared in emulsion by interfacial polymerization methods. By using orthogonal experiments, the optimum temperature, value of HLB and emulsification speed were determined. The results of IR contrast showed that chemical bonds existed between capsule core and monomer forming capsule wall. TEe absorption curve was regarded as standard I, and depending on it, the microencapsules were considered to be in form of cumulating tightly. So the data of TGA which were obtained by single scanning rate method were analyzed by Freeman-Caroll method and Achar-Brindley-Sharp-Wendworth method. The kinetics parameters were determined. The coefficient of regression R demonstrated that the reaction order that was deduced by two methods was same.
Keywords:polyurea   microencapsules   interfacial polymerization   thermal decomposition kinetics
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号