多芯片基板高频信号传输特性分析 |
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引用本文: | 丁俊民,周燕,孙海燕.多芯片基板高频信号传输特性分析[J].南通大学学报(自然科学版),2006,5(3):48-51. |
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作者姓名: | 丁俊民 周燕 孙海燕 |
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作者单位: | 1. 南通大学,江苏,南通,226007 2. 东南大学,江苏,南京,210096 |
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基金项目: | 江苏省高技术项目(BG2005022),南通大学自然科学基金资助项目(05Z114) |
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摘 要: | 基于陶瓷板材,完成了一种多芯片基板的设计,讨论了基板上高频信号线的传输线效应、互连延迟引起的时序问题以及串扰等信号完整性问题.根据二端口等效电路理论,提出了建立基板高频互连线Spice模型的方法,为芯片-封装协同设计提供了依据.
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关 键 词: | 互连线 多芯片基板 先进封装 建模 |
文章编号: | 1673-2340(2006)03-0048-04 |
收稿时间: | 2006-02-22 |
修稿时间: | 2006年2月22日 |
Analysis of Transfer Characteristic for High Frequency Signals in MCM Substrate |
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Authors: | DING Jun-min ZHOU Yan SUN Hai-yan |
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Abstract: | Based on ceramic material,a kind of MCM substrate is designed.The problems about signal integrity such as the transmission line effect of high-frequency signal lines,the time sequence caused by interconnection and cross talk are discussed.Finally,a method of building the Spice model with high-frequency interconnection line in the substrate is proposed,thus providing a foundation for coordination design of chip package. |
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Keywords: | interconnection line MCM substrate advanced package modeling |
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