微晶云母陶瓷微细孔超声加工正交试验

采用工件加振方式的微细超声加工方法和银钨合金工具,在厚度530μm的微晶云母陶瓷圆片上进行微细超声加工试验.通过5因素2水平正交试验分析了超声加工试验中振幅、工具进给速度和转速、工作液中金刚石磨粒粒度及金刚石质量分数对其工具体积损耗率的影响,并选择较优的参数组合,加工出孔径Φ80μm、深度530μm、孔侧壁锥度小于0.5°的微晶云母陶瓷通孔.

Orthogonal-Testing Experimental on Micro-Ultrasonic-Machining of Microcrystalline-Mica-Ceramic

Micro ultrasonic machining (micro USM) experiments were carried out on 530 μm thick microcrystalline mica ceramic（MCMC）slices with workpiece vibration and using silver tungsten alloy as tool materials. The experiments were designed by orthogonal testing method considering five factors and two levels to investigate the influences of ultrasonic amplitude, tool feed rate, tool rotate speed, abrasive particle size and abrasive concentration on tool volume wear rate in the micro USM of MCMC. Based on the experiments, a 80 μm through hole was machined successfully on 530 μm thick MCMC slice with the optimized micro USM parameters, and the taper of the hole is less than 0.5°.