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Photonic integrated technology for multi-wavelength laser emission |
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| Authors: | XiangFei Chen Wen Liu JunMing An Yu Liu Kun Xu Xin Wang JianGuo Liu YueFeng Ji NingHua Zhu |
| Institution: | 1. National Laboratory of Microstructures, Nanjing University, Nanjing, 210093, China 2. State Key Laboratory of Optical Communication Technologies and Networks, Wuhan Research Institute of Posts & Telecommunications, Wuhan, 430074, China 3. Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, China 4. Institute of Optical Communication and Optoelectronics, Beijing University of Posts and Telecommunications, Beijing, 100876, China |
| Abstract: | We summarized the design, fabrication challenges and important technologies for multi-wavelength laser transmitting photonic integration. Technologies discussed include multi-wavelength laser arrays, monolithic integration and modularizing coupling and packaging. Fabrication technique requirements have significantly declined with the rise of reconstruction-equivalent-chirp and second nanoimprint mask technologies. The monolithic integration problem between active and passive waveguides can be overcome with Butt-joint and InP array waveguide grating technologies. The dynamic characteristics of multi-factors will be simultaneously measured with multi-port analyzing modules. The performance of photonic integration chips is significantly improved with the autoecious factors compensation packaging technique. |
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