Preparation and characterization of microcapsule containing epoxy resin and its self-healing performance of anticorrosion covering material |
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Authors: | LePing Liao Wei Zhang Yi Xin HongMei Wang Yang Zhao WuJun Li |
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Institution: | 1. National Key Laboratory for Remanufacturing, Academy of Armored Force Engineering, Beijing, 100072, China 2. Institute of Chemical Defence, Beijing, 102205, China
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Abstract: | Microencapsulated healing agents that possess adequate strength, long shelf-life, and excellent bonding to the host material are required for self-healing materials. The in situ encapsulation method is demonstrated over an order of magnitude size reduction for the preparation of urea-formaldehyde (UF) capsules filled with a healing agent, a mixture epoxy resin of the epoxy 711 and E-51. Capsules with diameters as small as about 100 ??m are achieved under the agitation rate of 800 r min?1. The capsules possess a uniform UF shell wall (4 ??m average thickness). By using the analysis of scanning electronic microscope (SEM), thermal analysis (TG-DTA) and FTIR, the characteristics of the microcapsules were investigated respectively. Successful self-healing has been demonstrated for anticorrosion covering materials with microcapsules. |
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