球栅阵列垂直互联传输性能分析与基板叠层设计

为满足有源相控阵雷达中收发(T/R)组件的小型轻量化发展要求,用HFSS建立了球栅阵列（ball grid array,BGA）垂直互联模型,分析了关键结构参数对传输性能的影响,包括焊球半径、焊球中心距、地层反焊盘开孔半径、焊盘半径等；并根据应用场景设计了两种输入输出(I/O)方式的三维基板叠层结构。结果表明增大焊球半径、减小焊球中心距和适当的地层反焊盘半径有利于形成良好的微波传输性能,焊盘半径影响较小。优化后的垂直互联结构在X波段,回波损耗优于22.5dB,插入损耗优于0.13dB；设计的两种基板叠层结构均达到了良好的传输性能,满足不同的应用场景和接口形式,可有效实现组件小型化。

Transmission performance analysis of BGA vertical interconnection and stacked substrate design

In order to meet the requirements of miniaturization and lightweight development of T/R module in active phased array radar, the vertical interconnection model of ball grid array (BGA) is established with HFSS, and the influence of key structural parameters on transmission performance is analyzed, including solder ball radius, solder ball center distance, anti-pad radius of ground plane, pad radius, etc. Two types of three dimensional substrate stacked structures with different input-output (I/O) modes are designed according to application scenarios. The results show that increasing the radius of solder balls, decreasing the center distance of solder balls and choosing proper anti-pad radius are beneficial to the formation of good microwave transmission performance. The influence of pad radius is weak. Moreover, the return loss is better than 22.5dB, and the insertion loss is better than 0.13dB in X-band, after the vertical interconnection structure is optimized. The two types of substrate stacked structures both achieve good transmission performance, and meet different application scenarios and connection forms. Meanwhile, they can effectively realize the miniaturization of the module.