固态焊接中的等效压缩变形及应力应变分析

对固态压接升温、保温过程中存在的等效压缩变形现象及其产生进行了阐述，并在试验基础上对伴随等效压缩变形的应力应变进行了分析。结果表明：等效塑性压缩变形是焊件在升温、保温过程中受约束压力作用不能胀大而产生的塑性变形的累积，它提供了形成固态焊接接头所必需的塑性变形。等效压缩变形使焊件在被约束方向上的尺寸保持恒定，而约束压力则在焊件由表及里温升的差异、屈服极限随温度变化的不均匀性以及应力松弛的综合作用下发生增大、持平、快速减小直至缓慢减小的变化。

Equivalent Plastic Compressive Deformation in Solid-State Welding and Analysis of Stress and Strain

The phenomena and principle of the equivalent plastic compressive deformation(EPCD) existed in the process of increasing temperature and holding temperature of solid-state welding are expounded ,and the change of stress and strain when EPCD happens on the basis of experiment is analysed.The results indicate that EPCD is acumulative plastic deformation the workpiece produces due to no expansion under the effect of constraint pressure in the process of increasing temperatrue and holding temperature.EPCD provides the plastic deformation the solid-state welding joint needed,then make the workpiece's length becomes invariable in the constraint direction. Meanwhile constraint pressure under the integration effect of difference of temperature rising in workpiece's each part,uneven change of yield limit with the temperature and stress relaxation produces the changes as increasing,holding,fastly decreasing and slowly decreasing.