钨铜复合材料的制备技术

随着电器及电子等行业迅猛发展,钨铜材料的需求量越来越大。文章讨论了钨铜复合材料的常规制备技术,如熔渗法的基本过程以及对材料显微组织、致密度、力学性能以及导电性能等方面的影响;并分别从钨铜纳米粉末的制备、高速、高效粉末压制、快速粉末烧结三个方面展望了钨铜复合材料制备技术的未来发展方向。

Research Progress on Preparing W/Cu Composite Materials

With the rapid development of the electric and electronic industries in the world, the demand for W/Cu materials is increased. The basic processes for traditional techniques of preparing W/Cu composite materials, like infiltration are discussed in detail here. At the same time, the effect of the material produced by these methods on microstructure, density, mechanical properties and electrical conductivity, etc. is also illustrated. In addition, the future developments of advanced preparing techniques, including the preparation of nano-meter W/Cu powder, high-speed, greatly effective compression and instant sintering, have been put forward.