| 无铅焊点失效之铜扩散机理 |
| |
| 引用本文： | 罗道军,邹雅冰.无铅焊点失效之铜扩散机理[J].上海交通大学学报,2007(Z2). |
| |
| 作者姓名： | 罗道军 邹雅冰 |
| |
| 作者单位： | 中国赛宝实验室 广州510610 |
| |
| 摘 要： | 通过对失效焊点界面合金层的仔细分析和实验验证,发现了过度回流以及镍镀层龟裂将使焊盘基材上镀层铜异常地长距离扩散到金属间化物中,导致金属间化物与镀层之间的强度急速下降,使焊点在正常外力条件下都可能产生早期失效,这种失效机理正常情况下难以发觉.文中给出了控制这种早期失效的相应对策.
|
| 关 键 词： | 焊点失效 铜扩散 失效机理 |
The Copper-Diffusion Induced Failure of Lead-Free Solder Joints |
| |
| LUO Dao-jun,ZOU Ya-bing.The Copper-Diffusion Induced Failure of Lead-Free Solder Joints[J].Journal of Shanghai Jiaotong University,2007(Z2). |
| |
| Authors: | LUO Dao-jun ZOU Ya-bing |
| |
| Abstract: | By the analysis and experiments on the intermetallic compoud layer of failure solder point,it was found that extraordinary diffusion of copper on solder pad into intermetallic compound is caused by the excess reflowing and fissure in the nickel coating.That would lead to weak intensity between intermetallic compoud and coating,and premature failure in normal condition.Some suggestions were given for controlling this premature failure as mentioned. |
| |
| Keywords: | failure of solder point copper diffusion failure mechanism |
| 本文献已被 CNKI 等数据库收录！ |
|
