| MCM互连延时宏模型和物理参数 |
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| 引用本文： | 来金梅,林争辉.MCM互连延时宏模型和物理参数[J].应用科学学报,1998,16(1):51-55. |
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| 作者姓名： | 来金梅 林争辉 |
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| 作者单位： | 上海交通大学 |
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| 基金项目： | 国家九五重点科技攻关项目 |
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| 摘 要： | 该文给出了MCM互连延时的宏模型.用此宏模型研究了延时与MCM互连物理参数的关系,得出芯片之间的平均距离、负载数是影响MCM性能的重要参数.
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| 关 键 词： | 宏模型 延时 物理参数 MCM |
| 收稿时间： | 1996-05-10 |
| 修稿时间： | 1996-07-07 |
Macromodel of MCM Interconnection Delay and Its Physical Scaling |
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| LAI JINMEI,LIN ZHENGHUI.Macromodel of MCM Interconnection Delay and Its Physical Scaling[J].Journal of Applied Sciences,1998,16(1):51-55. |
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| Authors: | LAI JINMEI LIN ZHENGHUI |
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| Institution: | Large Scale Integration Institute, Shanghai Jiaotong University, Shanghai 200030 |
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| Abstract: | Macromodel of MCM interconnection delay is developed in this paper. With this model it is shown that the most important parameters dominating the performance of MCMs are the average distance between the chips and the size of the load capacitance. |
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| Keywords: | MCM macromodel interconnection delay physical parameters |
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