| SiC_p/A356铝合金复合材料触变挤压研究 |
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| 引用本文： | 马春梅,王开坤,徐峰.SiC_p/A356铝合金复合材料触变挤压研究[J].武汉科技大学学报(自然科学版),2010,33(2). |
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| 作者姓名： | 马春梅 王开坤 徐峰 |
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| 作者单位： | 北京科技大学材料科学与工程学院,北京,100083 |
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| 基金项目： | 国家高技术研究发展计划(863)项目，中电集团第四十三研究所创新基金项目，北京市自然科学研究基金项目，兰州理工大学有色金属合金及加工教育部重点实验室开放基金项目 |
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| 摘 要： | 采用有限元软件DEFORM-3DTM模拟SiCp/A356铝合金复合材料电子封装壳体的成形过程,应用等温压缩实验数据分析材料模型触变成形过程中金属流动速度场和温度场分布,并对可能产生的成形缺陷进行预测.研究发现,一模四件的模型更适合半固态触变成形,缺陷可能出现在最后成形的成形件侧棱两角.
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| 关 键 词： | SiCp/A356铝合金复合材料 触变成形 电子封装 速度场 温度场 |
Thixotropic extrusion of SiC_p/A356 aluminum alloy composite material |
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| Ma Chunmei,Wang Kaikun,Xu Feng.Thixotropic extrusion of SiC_p/A356 aluminum alloy composite material[J].Journal of Wuhan University of Science and Technology(Natural Science Edition),2010,33(2). |
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| Authors: | Ma Chunmei Wang Kaikun Xu Feng |
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| Institution: | Ma Chunmei,Wang Kaikun,Xu Feng(School of Materials Science , Engineering,University of Science , Technology Beijing,Beijing 100083,China) |
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| Abstract: | By using the finite element software DEFORM-3DTM,the formation of electronic packaging shell for the SiCp/A356 aluminum alloy composite materials is simulated.By using isothermal compression test data,the flow velocity field and temperature field of thixotropic during the process is analyzed,and the possible forming defects are predicted.The investigation shows that the model of one mould for four parts is more suitable for thixoforming,and the defects will probably appear in the lastly-formed edge corners ... |
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| Keywords: | SiCp/A356 aluminum alloy composite material thixoforming electronic packaging flow velocity field temperature field |
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