| 基于空气耦合超声激励的倒装芯片缺陷检测 |
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| 引用本文： | 廖广兰,张学坤,于龙,史铁林.基于空气耦合超声激励的倒装芯片缺陷检测[J].华中科技大学学报(自然科学版),2011(6):87-90. |
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| 作者姓名： | 廖广兰 张学坤 于龙 史铁林 |
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| 作者单位： | 华中科技大学数字制造装备与技术国家重点实验室; |
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| 基金项目： | 国家重点基础研究发展计划资助项目(2009CB724204); 国家自然科学基金资助项目(50805061,50975106) |
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| 摘 要： | 以FC倒装芯片振动模型为基础,阐述了利用固有频率变化进行芯片缺陷检测的原理.通过COMSOLMultiphysics软件对周边型FC芯片的前5阶模态进行了仿真分析,结果显示焊点缺失会引起FC芯片高阶固有频率的明显变化.利用基于空气耦合超声激励的FC芯片缺陷检测方法,对焊点缺失FC芯片的振动速度进行了测量,提取出了FC芯片的前5阶固有频率,测量结果与仿真结果一致,验证了该方法检测FC芯片缺陷的可行性.
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| 关 键 词： | 空气耦合 超声激励 倒装芯片 固有频率 缺陷检测 |
Fault detection of flip chip by using air-coupled ultrasound excitation |
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| Liao Guanglan Zhang Xuekun Yu Long Shi Tielin.Fault detection of flip chip by using air-coupled ultrasound excitation[J].JOURNAL OF HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY.NATURE SCIENCE,2011(6):87-90. |
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| Authors: | Liao Guanglan Zhang Xuekun Yu Long Shi Tielin |
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| Institution: | Liao Guanglan Zhang Xuekun Yu Long Shi Tielin(State Key Laboratory of Digital Manufacturing Equipment and Technology,Huazhong University of Science and Technology,Wuhan 430074,China) |
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| Abstract: | Based on the vibration model of flip chip(FC),a fault detection principle using the change of FC natural frequency was investigated.The first 5 order vibration modes of FCs with peripheral bumping solder were analyzed using COMSOL Multiphysics software.The simulation result shows that solder bumping missing can lead to the significant change for high order natural frequencies.A fault detection method of FC was proposed based on air-coupled ultrasound excitation.By measuring the vibration velocity of FC,the ... |
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| Keywords: | air-coupled ultrasound excitation flip chip(FC) natural frequency fault detection |
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