| 氮化硅光固化增材制造工艺与性能的研究 |
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| 引用本文： | 严鹏飞,严彪,王联凤,程灵钰.氮化硅光固化增材制造工艺与性能的研究[J].上海理工大学学报,2018,39(6):12-15. |
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| 作者姓名： | 严鹏飞 严彪 王联凤 程灵钰 |
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| 作者单位： | 同济大学 材料科学与工程学院, 上海 201804;上海制驰智能科技有限公司, 上海 201900,同济大学 材料科学与工程学院, 上海 201804;上海市金属功能材料开发应用重点实验室, 上海 201804,同济大学 材料科学与工程学院, 上海 201804;上海航天设备制造总厂有限公司, 上海 201100,上海航天设备制造总厂有限公司, 上海 201100 |
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| 基金项目： | 国家军工项目（17-163-13-ZT-010-036-02） |
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| 摘 要： | 通过设计浆料配方和设置打印参数，采用光固化增材制造（3D打印）的方法制备出氮化硅陶瓷样品。通过热重-差示扫描量热（TG-DSC）分析得到脱脂温度，确定了脱脂预烧结和高温陈化烧结工艺，得到了氮化硅陶瓷样品。试验结果：氮化硅陶瓷样品收缩率为水平方向65.1%，厚度方向80.0%；密度达到理论值的93.3%；抗拉强度为245.9~279.8 MPa，抗弯强度为308.5~333.2 MPa。平面方向收缩较大，可能引起了拉伸时的层状撕裂。
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| 关 键 词： | 增材制造 光固化 陶瓷浆料 3D打印 氮化硅 |
| 收稿时间： | 2018/1/4 0:00:00 |
Study on Stereo Lithography Additive Manufacturing Process and Properties Silicon Nitride |
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| YAN Pengfei,YAN Biao,WANG Lianfeng and CHENG Lingyu.Study on Stereo Lithography Additive Manufacturing Process and Properties Silicon Nitride[J].Journal of University of Shanghai For Science and Technology,2018,39(6):12-15. |
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| Authors: | YAN Pengfei YAN Biao WANG Lianfeng and CHENG Lingyu |
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| Institution: | School of Materials Science and Engineering, Tongji University, Shanghai 201804, China;Shanghai Zhichi Intelligent Technology Co., Ltd., Shanghai 201900, China,School of Materials Science and Engineering, Tongji University, Shanghai 201804, China;Shanghai Key Laboratory for R & D and Application of Metallic Functional Materials, Shanghai 201804, China,School of Materials Science and Engineering, Tongji University, Shanghai 201804, China;Shanghai Aerospace Equipments Manufacturer Co., Ltd., Shanghai 201100, China and Shanghai Aerospace Equipments Manufacturer Co., Ltd., Shanghai 201100, China |
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| Abstract: | Stereo lithography additive manufacturing (3D printing) method was used to prepare silicon nitride samples by designing ingredient slurry and setting printing parameter. Degreasing temperature was obtained by thermogravimetry-differential scanning calorimetry(TG-DSC) analysis. Degreasing pre-sintering and high temperature aging sintering processes were determined based on degreasing temperature, which was obtained by TG-DSC analysis. Silicon nitride samples were prepared. The results show that the horizontal and thick shrinkage of silicon nitride samples are 65.1% and 80.0% relatively. The density reaches 93.3% of the theoretical value. Tensile strength is 245.9-279.8 MPa. Bending strength is 308.5-333.2 MPa. Larger contraction in plane direction may cause layered tearing during tension. |
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| Keywords: | additive manufacturing stereo lithography apparatus ceramic slurry 3D printing silicon nitride |
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