| 金属铜胶体的表面修饰与氧化研究 |
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| 引用本文： | 郑化硅 李成韦. 金属铜胶体的表面修饰与氧化研究[J]. 中国科学技术大学学报, 1998, 28(6): 722-725 |
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| 作者姓名： | 郑化硅 李成韦 |
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| 作者单位： | 中国科学技术大学化学系 |
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| 摘 要： | 制备了纯金属铜胶体，并用金对其表面进行修饰，用热重和紫外可见吸收光谱对铜胶体表面修饰反应及铜胶体在空气中的氧化进行了研究．实验表明修饰反应是两个平行氧化还原反应，铜总量的万分之一金的存在即可有效地阻止铜胶体的氧化．
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| 关 键 词： | 铜胶体，修饰，平行氧化还原 |
Dressing and Oxidation of Copper Colloid |
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| Zheng Huagui Li Chengwei Liu Yuanhui Zeng Jinghui Li Yadong. Dressing and Oxidation of Copper Colloid[J]. Journal of University of Science and Technology of China, 1998, 28(6): 722-725 |
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| Authors: | Zheng Huagui Li Chengwei Liu Yuanhui Zeng Jinghui Li Yadong |
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| Abstract: | Colloids of pure copper were prepared from the solution of copper sulfate with hydrazine. Surface copper particles in colloids were dressed with Au. TG and UV-visible absorption spectrum were utilized in the research of dressing and oxidation reaction of colloid. It is shown that the dressing reaction consists of two parallel redox reactions,the existance of auric chloride acid with of 0.01 percent of total copper can effectively prevent the copper colloid from oxidation. |
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| Keywords: | copper colloid dressing parralled redox reaction |
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