| 某小型化电子设备热设计及试验验证 |
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| 引用本文： | 唐琳.某小型化电子设备热设计及试验验证[J].盐城工学院学报(自然科学版),2011,24(2):47-49. |
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| 作者姓名： | 唐琳 |
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| 作者单位： | 中国电子科技集团公司第十研究所,四川成都,610036 |
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| 摘 要： | 热设计是影响电子设备可靠性的一个重要因素,电子设备的小型化对热设计提出了更高的要求。对某小型化电子设备在方案阶段进行了热设计及热仿真分析,并对产品实物的散热进行了试验验证,探讨了小型化电子设备的一种热设计及试验验证方法。
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| 关 键 词： | 热设计 电子设备 小型化 |
Thermal Design and Experimental Verification of a Miniaturized Electronic Equipment |
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| TANG Lin.Thermal Design and Experimental Verification of a Miniaturized Electronic Equipment[J].Journal of Yancheng Institute of Technology(Natural Science Edition),2011,24(2):47-49. |
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| Authors: | TANG Lin |
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| Institution: | TANG Lin (The 10th Institute of China Electronics Technology Group Corporation,Sichuan Chengdu 610036,China) |
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| Abstract: | Thermal design is very important for reliability of electronic equipments.Due to miniaturization of electronic equipment,the higher request is put forward to the thermal design.Thermal design and thermal analysis of the miniaturization of an electronic equipment were carried out in the conceptual stage,and the heat distribution of the product was verified through experiment.A method of thermal design and experiment was argued about miniaturization of electronic equipment. |
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| Keywords: | Thermal design Electronic equipment Miniaturization |
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