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程控交换机触发开关焊点的红外无损检测
引用本文:滕京华,徐胜林,郑中兴. 程控交换机触发开关焊点的红外无损检测[J]. 北京交通大学学报(自然科学版), 1992, 0(2)
作者姓名:滕京华  徐胜林  郑中兴
作者单位:北方交通大学物理系,北方交通大学物理系,北方交通大学物理系
摘    要:初步探讨了焊点的红外检测规律,给出了物理模型,分析了焊点检测中各种本数的关系,并通过大量实验,找出了焊点的热分布曲线特征,为自动化在线检测提供了依据.

关 键 词:焊点  紅外辐射  无损检测

Infrared NDT to the Soldered Junction of Touching Switch in PCTE
Teng Jinghua,Xu Shenglin,Zheng Zhongxing. Infrared NDT to the Soldered Junction of Touching Switch in PCTE[J]. JOURNAL OF BEIJING JIAOTONG UNIVERSITY, 1992, 0(2)
Authors:Teng Jinghua  Xu Shenglin  Zheng Zhongxing
Affiliation:Department of Physics
Abstract:In this paper, we discussed the principle of infrared testing to soldered junction, assumed a physical model and analysed the relationships between the parameters. The heat distribution feature of the soldered junction was found out through large amounts of experiments and it is very helpful for the automatic on-line NDT inspection.
Keywords:soldered junction  infrared radiation  non-destructive tests
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