| 集成硅力敏器件的温度和非线性补偿 |
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| 引用本文： | 田敬民. 集成硅力敏器件的温度和非线性补偿[J]. 西安理工大学学报, 1988, 0(1) |
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| 作者姓名： | 田敬民 |
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| 作者单位： | 陕西机械学院自动控制系 |
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| 摘 要： | 本文主要论述了为提高力敏器件的性能和可靠性,进行温度补偿和非线性补偿的工作原理。结合理论计算和实验结果给出外围电路设计的基本依据。讨论了温度与非线性补偿整体化问题。以上面论述结果为基础,给出了一种典型的力敏器件的芯片剖面图。
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| 关 键 词： | 硅浆成力敏器件 温度补偿 非线性补偿 外围电路 芯片 |
Temperature and Non-linearity Compensation for Silicon Integrated Pressure Sensor |
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| Tian Jingmin. Temperature and Non-linearity Compensation for Silicon Integrated Pressure Sensor[J]. Journal of Xi'an University of Technology, 1988, 0(1) |
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| Authors: | Tian Jingmin |
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| Affiliation: | Tian Jingmin |
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| Abstract: | This paper mainly discussed operation principles of temperature and non-linearity compensation for improving precision and reliability of pressure sensors.The basic design principle of external circuit is deduced from theoretical calculation and experimental evidences.The problems about tem- perature and non-linearity compensation integration in a chip are also discuss- ed.Cross-section illustration of the chip for one typical integrated pressure sensor element is given according to the above discussed results. |
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| Keywords: | silicon integrated pressure sensor temperature compensation noa-linearity compensation exernal circuit chip |
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