| 平面热弹性问题的力学相似分析 |
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| 引用本文： | 王元淳,松本锳一,关谷壮.平面热弹性问题的力学相似分析[J].上海交通大学学报,1986(2). |
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| 作者姓名： | 王元淳 松本锳一 关谷壮 |
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| 作者单位： | 上海交通大学工程力学系，大阪府立大学，大阪电气通信大学 |
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| 摘 要： | 本文叙述了多连通域二维热弹性问题与平板弯曲问题的力学相似性,以及解平面热弹性问题的实验方法。求出了具有偏心圆孔的圆形平板的热应力。实验结果与数值解非常接近。
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| 关 键 词： | 多连通域 平面热弹性 平板弯曲 力学相似 相似实验 |
Mechanical Analogic Analysis of Plane Thermoelastic Problems |
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| Wang Yuanchun E. Matsumoto T. Sekiya.Mechanical Analogic Analysis of Plane Thermoelastic Problems[J].Journal of Shanghai Jiaotong University,1986(2). |
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| Authors: | Wang Yuanchun E Matsumoto T Sekiya |
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| Institution: | Wang Yuanchun E. Matsumoto T. Sekiya |
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| Abstract: | In this paper, mechanical analog between two-dimensional thermoelastic problems for multiply-connected regions and plate bending problems is discussed, and the experimental method for the solution of plane thermoelastic problems is developed. The thermal stress of the circular region with an eccentric circular hole is then derived. The experimental results are in good agreement with the numerical solutions. |
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| Keywords: | multiply-connected region two-dimensional thermoelasticity plate bending mechanical analog analogous experiment |
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