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硫酸钙晶须的表面改性研究
引用本文:印万忠,王晓丽,韩跃新,袁致涛.硫酸钙晶须的表面改性研究[J].东北大学学报(自然科学版),2007,28(4):580-583.
作者姓名:印万忠  王晓丽  韩跃新  袁致涛
作者单位:东北大学,资源与土木工程学院,辽宁,沈阳,110004;东北大学,资源与土木工程学院,辽宁,沈阳,110004;东北大学,资源与土木工程学院,辽宁,沈阳,110004;东北大学,资源与土木工程学院,辽宁,沈阳,110004
基金项目:国家自然科学基金,教育部跨世纪优秀人才培养计划
摘    要:采用硼酸酯表面活性剂SBW-181对硫酸钙晶须进行了单因素条件改性试验,分别考察了改性剂用量、改性温度、改性时间和搅拌速率等工艺因素对硫酸钙晶须表面改性的影响.试验结果表明:硼酸酯表面活性剂SBW-181对硫酸钙晶须的改性效果较好,在最佳工艺条件下,改性产品的活化指数为0.996,接触角为103.4°.建立了硼酸酯表面活性剂SBW-181与硫酸钙晶须的作用模型.得出的结论对硫酸钙晶须表面改性的工业化生产具有重要的指导意义,并为硫酸钙晶须的应用研究奠定了理论基础.

关 键 词:硫酸钙晶须  表面改性  硼酸酯表面活性剂  活化指数  接触角
文章编号:1005-3026(2007)04-0580-04
收稿时间:2006-04-22
修稿时间:2006-04-22

On the Surface Modification of Calcium Sulphate Whiskers
YIN Wan-zhong,WANG Xiao-li,HAN Yue-xin,YUAN Zhi-tao.On the Surface Modification of Calcium Sulphate Whiskers[J].Journal of Northeastern University(Natural Science),2007,28(4):580-583.
Authors:YIN Wan-zhong  WANG Xiao-li  HAN Yue-xin  YUAN Zhi-tao
Institution:(1) School of Resources and Civil Engineering, Northeastern University, Shenyang 110004, China
Abstract:The borate surfactant SBW-181 was used for the modification experiments of calcium sulphate whiskers on the conditions of individual factors. Influences of the technical factors such as surfactant dosage, modification temperature/time and stirring speed on the surface modification of calcium sulphate whiskers were studied. The modified calcium sulphate whiskers were characterized with activation index, contact angle, SEM and IR spectrum analysis, and the results indicated that the SBW-181 has good effect on surface modification of calcium sulphate whiskers. On the optimum technological conditions, the activation index of modified product is 0.996 with a contact angle of 103.4°. A reaction model was developed relevantly for the whiskers and surfactant, and a conclusion drawn from that plays a role of guidance in the industrialized surface modification of calcium sulphate whiskers as a theoretical reference offered for their applications.
Keywords:calcium sulphate whiskers  surface modification  borate surfactant  active exponent  contact angle
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