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DC磁控溅射沉积FexN薄膜成分及生长机制
引用本文:王欣,高丽娟,郑伟涛,徐跃.DC磁控溅射沉积FexN薄膜成分及生长机制[J].吉林大学学报(理学版),2002,40(4):397-399.
作者姓名:王欣  高丽娟  郑伟涛  徐跃
作者单位:1.吉林大学材料科学与工程学院,长春,130023; 2.吉林大学分析测试中心,长春,130023
摘    要:使用直流磁控溅射方法,Ar/N2作为放电气体,在玻璃衬底上沉积FexN薄膜.利用X射线光电子能谱(XPS)、掠入射小角X射线散射(GISAXS)、X射线衍射(XRD)、掠入射非对称X射线衍射(GIAXD)和原子力显微镜(AFM)研究薄膜的成分和生长机制.实验结果表明,在5%N2流量下获得FeN0.056单相化合物,薄膜中氮原子含量为14%,该值与α"-Fe16N2相中的氮原子的化学计量(11%)接近;GISAXS和AFM对薄膜表面分析表明,随溅射时间增加,薄膜变得愈加不光滑,用动力学标度的方法定量分析结果为:薄膜表面呈现自仿射性质,静态标度指数α≈0.65,生长指数β≈0.53±0.02,动力学标度指数z≈1.2,薄膜生长符合Kolmogorov提出的能量波动概念的KPZ模型指数规律.

关 键 词:FexN薄膜  直流磁控溅射  生长机制  
文章编号:1671-5489(2002)04-0397-03
收稿时间:2002-04-23
修稿时间:2002年4月23日

The Composition and Growth Mechanism of Iron Nitride Thin Films Deposited by DC Magnetron Sputtering
WANG Xin,GAO Li-juan,ZHENG Wei-tao,XU Yue.The Composition and Growth Mechanism of Iron Nitride Thin Films Deposited by DC Magnetron Sputtering[J].Journal of Jilin University: Sci Ed,2002,40(4):397-399.
Authors:WANG Xin  GAO Li-juan  ZHENG Wei-tao  XU Yue
Institution:1.College of Materials Science and Engineering , Jilin University , Changchun 130023 , China; 2. Measurement and Testing Center , Jilin University , Changchun 130023 , China
Abstract:Iron nitride films were deposited on glass substrate by DC magnetron sputtering with mixed Ar/N2 as discharge (N2 fraction of 5%) and at different time ( 30 min , 20 min , 10 min , and 5 min , respectively ) . The composition of the films was analyzed by means of X-ray photoelectron spectroscopy experiment (XPS) . The layer phases and the surface morphologies of the films were characterized with the aid of grazing incidence X-ray scattering and X-ray diffraction as well as atomic force microscopy . For the film grown at N2 fraction of 5 % , the phase of FeN0.056appeared . The surface of the films showed the selfaffine character . The values of roughness exponent α≈ 0.65 and growth exponent β≈ 0.53 are in agreement with the improvised KPZ exponents based on Kolmogorov's energy cascade concept .
Keywords:" target="_blank">xN film zz')" href="#">      FexN film  DC magnetron sputtering  growth mechanism
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