用于印制线路板的新退焊锡剂研究

本研究采用烯丙基磺酸 (作络合剂 )、硝酸 (作氧化剂 )、硝酸铁 (作均相催化剂 )和咪唑 (防铜蚀抑制剂 )为组分开发了一种新的退焊锡剂 ,它具有优良的退锡特性—退速快 (≤ 30s) ,退除容量大 (≥ 10 0g/L) ,对铜无腐蚀 ,体系中不出现沉积物以及产品的颜色光亮 .喷射退锡实验的结果说明本退锡剂各组份的适宜浓度范围为 :HNO3为 60～ 150g/L ,Fe(NO3) 3为 4 5～ 110g/L ,烯丙基磺酸为 80～ 140g/L以及咪唑为 6～ 12g/L ;它们的最佳范围依次为 12 0～ 140g/L ,90～ 110g/L、10 0～ 12 0g/L和 8～ 9g/L 图 2 ,表 2 ,参 5

Studies of a new composition for stripping tin/lead films from printed circuit boards

A new stripper solution was studied by selecting allyl sulfonic acid as ligand, nitric acid as oxidant,ferric nitrate as homogeneous catalyst and imidazole as inhibitor,and it is characterized by excellent stripping performance including fast stripping speed≤30 seconds, great stripping capacity(≥100 metal g/L), no attack on the exposed copper ,no sludge in the process and beautiful color of the product.The effective concentration ranges of each component of the stripper solution , determined by stripping tests with spray-technique, were nitric acid 60～150 g/L, ferric nitrate 45～110 g/L , allyl sulfonic acid 80～140 g/L and imidazole 6～12 g/L respectively,and optimally 120～140 g/L for nitric acid , 90～110 g/L for ferric nitrate ,100～120 g/L for allyl sulfonic acid and 8～10 g/L for imidazole.2figs.,2tabs.,5refs.